GF125 | BROOKS
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Mass Flow ControllerPRODUCT NAME: Mass Flow Controller GF125
BRAND NAME: Brooks MODEL: GF125 CATEGORY: Brooks DESCRIPTION: >>Ultra fast reponse reduces process stabilization time to drive improves throughput >>PTI technology eliminates pressure transient effects for tighten preocess control Multi-gas/multi-range user configurability support process development, reduces lead-times and inventory requirement >>Independant service port for data-logging and process fingerprinting DETAIL: High Performance Flow Control The Brooks Instrument GF125 mass flow controller builds upon our leadership position in pressure transient insensitive (PTI) technology. The GF125 is a continuous improvement (CIP) redesign of Brooks’ core PTI technology, delivering enhanced cost of ownership, device to device reproducibility and environmental compliance, to meet the challenges of advanced semiconductor and thin-film processes. Brooks’ new sensor technology with improved signal to noise performance delivers enhanced measurement stability to drive tighter gas chemistry control while reducing maintenance requirements. Standard Features • Ultra high purity construction with reduced surface area and removal of unswept volumes for faster dry-down during purge - Surface passivated SEMI F-20 compliant wetted flow path - 4μ inch Ra surface finish • New independent service and diagnostic port supports on-tool troubleshooting and process optimization • New modular architecture supports all industry standards for full OEM and process coverage - Downported 80 mm and 92 mm C-seal and W-Seal, in 1.125" and 1.5" footprints - 124mm 4 VCR - 9-pin “D” analog/RS-485 or 5-pin “M8” DeviceNet • Gas and range configurable (MG/MR) - MG/MR model created and proven using actual process gases to ensure real world accuracy - Change full scale flow range up to 3:1 for optimum process and inventory management flexibility - Select from hundreds of Semi gases and gas mixtures Applications • Dielectric etch • Polysilicon etch • Metal etch • Low k deposition • Sub-atmospheric • Plasma enhanced deposition • Plasma enhanced atomic layer deposition • High density plasma deposition • Low pressure plasma deposition • High temperature annealing • Metal oxide deposition Ultra Fast Response Fast set point control via high speed ARM processor and low noise sensor drive circuit. Typical set point response is 300 milliseconds from set point command to desired flow output per SEMI E17-0600 within the recommended operating range. • Improve wafer throughput by reducing nonproductive flow settling time • Reduce divert gas consumption and associated abatement costs Pressure Transient Insensitive (PTI) GF125 is equipped with PTI technology, which reduces the effect of pressure fluctuations on gas flow. The technology is simple: a powerful ARM processor, integrating thermal flow sensor and pressure transducer outputs, compensate for upstream and downstream pressure transients by directing a control valve to open or close to an appropriate orifice size. Users report stable flow in typically difficult flow management conditions • Eliminate overshoot/undershoot and first run effect • Eliminate regulator burst/sag and MFC crosstalk effect • Reduce impact of valve sequencing Multi Gas/Multi Range Technology MG/MR is a technology that allows users to configure standard configurations (“SHs”) or “blanks” for a variety of supported gases and flow ranges. This wide dynamic range and configurable gas options enable users to reduce unique inventory requirements. • Reduce part numbers • Reduce typical delivery times • Reduce tool downtime SPECIFICATION: GF125 Mass Flow Controllers Specifications Display Type : Top mount integrated Viewing Angle : Fixed Viewing Distance : 10 feet Unit Displayed : Flow (%), temp. (°C), pressure (psia/kPa) Resolution : 0.1 (unit) Diagnostics Status Lights : MFC health, network status Alarms : Sensor output, control valve output, over temperature, over pressure, power surge/sag, network interruption Materials Gas Path : SEMI F20 compliant Surface Finish: 4 μ in Ra (0.1 μm Ra) Seals : Metal Weight : <2.65 lbs (1.20 kg) Electrical Power Consumption : 545 mA (max) @ 11 VDC and 250 mA (max) @ 24 VDC 6 watts (max) @ ±15 VDC Certifications : EMC 89/336/3EEC (CE), ODVA, RoHSWEEE Electronic Communication Interface Options Primary Connectors : DeviceNet™ via 5-pin “M8” connector; Analog/RS-485 via 9-pin “D” connector Diagnostic Port : RS-485 via 2.5 mm jack Performance Leak Integrity (external) : 1 x 10–11 atm. cc/sec He Valve Shut Down (leak by) : 1% full scale flow Linearity : ±0.5% full scale Repeatability and Reproducibility : ±0.15% set point Zero Drift : <0.5% full scale per year Auto Shut-Off : Valve off at set point <2% full scale Warm Up Time : 60 minutes SH40–SH44 SH45–SH46 SH47–SH48 Settling Time : 300 msec ; 400 msec ; 500 msec Standard Accuracy 5% to 35% : ±0.35% FS ±0.35% ; FS ±0.35% FS 35% to100% : ±1.0% SP ; ±1.0% SP ; ±1.0% SP High Accuracy option* : 2% to 10% : ±0.05% FS ; ±0.05% FS ; ±0.1% FS 10% to 100% : ±0.5% SP ; ±0.5% SP ; ±1.0% SP Operating Conditions SH40–SH44 ; SH45–SH46 ; SH47–SH48 Flow Range : 3–860 sccm ; 861–7200 sccm ; 7201–30000 sccm Proof Pressure : 140 psia max Transient Pressure : ±2 psid over 0.1 seconds Differential Pressure** : 7–45 psid ; 10–45 psid ; 15–45 psid*** Valve Configuration : Normally closed Temperature Range : 10°C–50°C Zero Temperature Coefficient : 0.005 full scale per ºC |
